Technology

Molding

Wire Bond Technology is still the mainstream in the manufacturing in electronic packages, and has moved toward finer pitch in response to increased demands for more I/Os in smaller spaces. SPIL now has mature capability for implementation of various kinds of fine pitch wire bonds

Thin Mold

Thin mold packages are particularly well suited for electronic systems applications requiring broad performance characteristics, including computing, video/audio, telecommunications, data acquisition, communication, etc..

Exposed Die

Molding process is the key process of exposed die FCCSP and requires to be proceeded in specific film type molding equipment.