IC Packaging

The electronics market trend is to offer more functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. Siliconware Stacked die packages are continuously being upgraded to meet these demands. Compared to single die packages, the stacked die package combines with several different functional devices, or increases memory density within same footprints as a single die package. The Siliconware stacked die package line-up includes substrate base and lead frame base utilizing advanced assembly technologies.

What is a Stacked Die Package?

The stack die package is a technology, which stacks multiple dice vertically in the same package. For example, stacks multiple memory dice to increase memory density, or combines ASIC with memory dice.

Why use Stacked Die Package?

ncreasingly more design engineers around the world have discovered working with Siliconware is the sure way to resolve their increasing demands for stacked die packaging. The stacked die package offers you multiple functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. The stacked die package is the ideal solution for system in package applications such as wireless product, portable product, and memory card. Siliconware's extensive experience, robust infrastructure and strong R&D team allow us to share the latest technology developments with you and still provide packages with reduced turnaround times at high volumes.

STANDARD PROCESS FLOW AND MATERIALS