Technology

2.5D/3D Integration with TSV

What is TSV Technology

Through-Silicon-Via (TSV) is a technique to provide vertical electrical interconnections passing through a silicon die to effectively transmit signal or power for homogeneous and heterogeneous integration.

TSVs are manufactured in wafer form and filled with Cu to provide the interconnection of die to die and die to substrate.

2.5D IC & 3D IC Package

2.5D IC

In 2.5D, several dies placed side by side above a passive silicon interposer without functionality and through the interposer to connect either memory packages or logic dies.

3D IC

In 3D, it is benefited from shorter distance of circuit by stacking dies vertically to save power consumption while boost the performance and keep small form factor in one single package for high bandwidth and multi-function integration.

Application

• High-End Application for High Performance Computing, Networking & Data servers

Benefits

• High IO / High bandwidth with short routing distance

• Energy efficiency

• Small form factor

Key enabling technology for 2.5D/3DIC in SPIL

MEoL (Middle End of Line)

• Carrier Bond/de-bond Technology

• Wafer Thinning Technology

• TSV Reveal Technology

• C4 and Micro Bumping Technology

BEoL (Back End of Line)

• Die Stacking Assembly Technology