Technology
先進技術
- 先進技術
- FanOut-WLP
What is FO-WLP:
Fan-Out Wafer Level Package (FO-WLP) has been developed to offer additional space for routing higher number of I/O on top of silicon chip area and extending the package size with so-called the fan-out process which cannot be possibly applied in conventional Fan-In Wafer Level Package (FI-WLP).
Fan-Out Wafer Level Package
Target Application :
- Low Pin Count Application for PMIC/ RF/ WIFI/ PA/ Audio etc.
Benefits :
- Single or multiple dies embedded in molding compound to have more IO than WLCSP by applying fan-out wafer level RDL processes.
- Thin dielectrics RDL with fine lines routing capability.
Target Application :
- Mobile Application for Smart Phone & Tablet, High-End AP/BB
Benefits :
- Small form factor & thin package
Target Application :
- High-End Application for High Performance Computing, Networking & Data servers
Benefits :
- High IO / High bandwidth with fine line/multi-layer RDL routability
- Bridging technology in molding compound
