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Fine Pitch WB

What is Cu Wire & fine pitch Technology

1.Cu wire technology

Wire inductance and capacitance are almost the same when Au / Cu wire diameter is fixed.
Cu wires have better electrical performance due to low resistance parasitic comparing with gold wires.

2.Fine pitch technology

The pad pitch < 45um is the so-called fine pitch, which can have more powerful functions in the design of smaller chips

Application

Fine pitch design allows higher wire density in electronic products, such as smart phones, media tablets, TV , wifi controller, game consoles, etc.

Benefits

Low cost:

Gold makes up majority of wire cost.
Gold price has risen 153% since 2007.

High efficiency:

Small size and high output (I/O)
High heat dissipation, low noise

The packaging process is constantly developing in the direction of reducing the chip size or integrating more functions in the same chip area to increase the number of I/Os and reduce cost considerations. Among them, "fine pitch bonding" (fine pitch bonding) technology, due to the above conditions.

Cu Wire Bond Roadmap

Item	Technology Item	Production	Avaliable		Engineering
Cu Wire	Wafer Technology	ULK/ELK 22/20 nm	ULK/ELK 22/20 nm	ULK/ELK 18 nm	ULK/ELK 16/14 nm
	Bond Pad structure	BOAC / CUP	BOAC / CUP	BOAC / CUP	BOAC / CUP
	Bond Pad Pitch (um)	45	47	45	43
	Bond Pad Open (um)	40	43	40	38
	Wire Diameter (mil)	0.65	0.7	0.65	0.6
	Bond Pad Structure	Tri-tiers/ Quad-tiers	Tri-tiers/ Quad-tiers	Tri-tiers/ Quad-tiers	Tri-tiers/ Quad-tiers
	Pad to Pad Bonding	Au+Cu	All Cu Wire	All Cu Wire	All Cu Wire