Technology
先進技術
- 先進技術
- Package on Package (PoP)
What is PoP Technology
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages.
Benefits
• Components are tested separately
• Procurement flexibility : memory components
• Faster time to Market.
The most obvious benefit is motherboard space savings.
Electrically, PoP offers benefits by minimizing track length between different interoperating parts, such as a controller and a memory. This yields better electrical performance of devices, since shorter routing of interconnections between circuits yields faster signal propagation and reduced noise and cross-talk.
POP(Package On Package) Bottom Package Development Direction
