Technology
先進技術
- 先進技術
- System in Package (SiP)
What is SiP Technology
A System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a IC quasi-package or a IC package.
The package structure of SiP module includes:
Applications
Electronic devices have been integrating more functions. The design of a product is getting more complicated. Modulated design in a product only can help us to shorten the time to market but also enhance the performance, for applications below.
Benefits
Key advantages of applying SiP solution in a product design include:
• Small Form Factor
• Fast Time-to-Market (Simplify the Design)
• Better Performance
• Pre-Tested and Pre-Qualified (Better Production Efficiency & Yield)
Provide Total Solution to Customers
By integrating system design capability with advanced IC packaging technology, SPIL provides services, including design, bumping, wafer sort, PKG assembly and testing, to satisfy customers’ requirement of “One Stop Shop” Solution.
The production line is also well arranged with CIM (Computing Integrating Manufacturing). The Shop Floor Control System provides good quality control and material, component and process traceability.
