Technology
先進技術
- 先進技術
- Flip Chip
Flip Chip
Siliconware's Flip Chip packages provide the ideal solution for low to high I/O, high electrical performance demand in high end memory, ASICs, microprocessor applications where high frequency, high speed are required. The package offers ball counts in excess of 2597 with higher electrical performance compared to the traditional BGA package. Siliconware offers the flip chip packages both in the BGA and CSP type, and continues to develop the widest range of flip chip interconnected packages to meet customers' demand. Siliconware serves a full turn-key solution for wafer bumping, wafer sort, flip chip assembly and testing services.
Cu Pillar and BOT
The typical bump structure of Cu pillar bump is as below; bump UBM was sputtered on PSV (SiN or PI) and Cu post with solder tip formed by plating process...
The typical bump structure of Cu pillar bump is as below; bump UBM was sputtered on PSV (SiN or PI) and Cu post with solder tip formed by plating process...
Fine Pitch Die Bond
Moore's law has been slowed down in transistor scaling, but the demands of high computing processing does not cool down and the data rate transmission is growing exponentially in each day. The surge in high data rate causes present DDR4 memories...
Moore's law has been slowed down in transistor scaling, but the demands of high computing processing does not cool down and the data rate transmission is growing exponentially in each day. The surge in high data rate causes present DDR4 memories...
